1. 2. 3. material content data sheet sales product name tle8386el issued 28. august 2013 ma# MA000971506 package pg-ssop-14-3 weight* 83.06 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.030 2.44 2.44 24439 24439 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 415 non noble metal iron 7439-89-6 0.689 0.83 8296 non noble metal copper 7440-50-8 27.978 33.68 34.56 336844 345659 wire noble metal gold 7440-57-5 0.199 0.24 0.24 2395 2395 encapsulation organic material carbon black 1333-86-4 0.099 0.12 1196 plastics epoxy resin - 4.570 5.50 55017 inorganic material silicondioxide 60676-86-0 45.001 54.19 59.81 541799 598012 leadfinish non noble metal tin 7440-31-5 0.976 1.18 1.18 11752 11752 plating noble metal silver 7440-22-4 0.768 0.92 0.92 9242 9242 glue plastics epoxy resin - 0.177 0.21 2125 noble metal silver 7440-22-4 0.530 0.64 0.85 6376 8501 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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